Products

DOWSIL™ TC-5026 – Single-part, non-curing thermally conductive silicone compound for MPU cooling in electronics

  • Item Name: DOWSIL™ TC-5026 Thermally Conductive Compound

  • Manufacturer: The Dow Chemical Company

  • Technologies: Single-part, grease-like silicone with thermally conductive metal oxide fillers

  • Color: Gray

  • Cure Type: Non-curing

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: Contact to Techniq VN for details.

1. Product Overview

DOWSIL™ TC-5026 is a gray, flowable, non-curing thermally conductive silicone compound. It is solventless, capable of achieving thin bond line thickness, and provides very low thermal resistance with high thermal conductivity. Designed to conduct heat away from sensitive components, it does not require curing ovens and maintains stability under high temperatures, making it suitable for electronic cooling applications.


2. Applications

  • Cooling of MPUs in servers, desktops, notebooks, and game consoles

  • Acts as a thermal “bridge” between devices and heat sinks or chassis

  • Enhances heat transfer efficiency and overall device reliability

Application Methods: Manual or automated placement; no curing required.

3. Typical Properties

Property Unit Result
One or Two-part One
Color Gray
Viscosity cP / mPa·s / Pa·s 100,000 / 100,000 / 100
Specific Gravity (Uncured) 3.5
Non-Volatile Content (NVC) % 99.95
Thermal Conductivity btu/hr·ft·°F / W/m·K 1.7 / 2.9
Thermal Resistance at 40 psi °C·cm²/W 0.03
Bond Line Thickness (BLT) at 40 psi mm / inch / mils 0.007 / 0.0003 / 0.3
Dielectric Strength volts/mil / kV/mm 227 / 8.9
Volume Resistivity ohm·cm 5.9 × 10¹¹
Dielectric Constant at 1 kHz 7.4
Dissipation Factor at 1 kHz 0.0003

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