Brand Name: DOWSIL™ TC-5026 Thermally Conductive Compound
Package Size: Available in 1 kg bottles and 25 kg pails.
Shelf Life: 720 days (approximately 24 months) from the date of manufacture.
DOWSIL™ TC-5026 Thermally Conductive Compound is a one-part, gray, non-curing silicone-based material engineered to facilitate efficient heat dissipation in electronic components. Its solvent-free formulation ensures material stability over time, eliminating the need for curing ovens. The compound is designed to achieve ultra-thin bond line thicknesses (BLT) at low pressure, resulting in very low thermal resistance and high thermal conductivity. These properties make it particularly suitable for cooling microprocessor units (MPUs) in servers, desktops, notebooks, and game consoles.
Applications
DOWSIL™ TC-5026 is specifically designed for thermal management in electronic devices, including:
Its properties make it ideal for applications where efficient thermal transfer is critical to device performance and longevity.
DOWSIL™ TC-5026 Thermally Conductive Compound
Typical Properties
The following table summarizes the key properties of DOWSIL™ TC-5026:
| Property | Unit | Value |
|---|---|---|
| Color | — | Gray |
| Viscosity | cP (mPa·s) | 100,000 |
| Specific Gravity (Uncured) | — | 3.5 |
| Non-Volatile Content | % | 99.95 |
| Thermal Conductivity | W/m·K | 2.9 |
| Thermal Resistance at 40 psi | °C·cm²/W | 0.03 |
| Bond Line Thickness at 40 psi | mm (inch) | 0.007 (0.0003) |
| Dielectric Strength | volts/mil (kV/mm) | 227 (8.9) |
| Volume Resistivity | ohm·cm | 5.9 × 10¹¹ |
| Dielectric Constant at 1 kHz | — | 7.4 |
| Dissipation Factor at 1 kHz | — | 0.0003 |
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