DOWSIL™ TC-5026 is a gray, flowable, non-curing thermally conductive compound designed for efficient heat dissipation in electronics. It offers:
DOWSIL™ TC-5026 is used for thermal management in high-performance electronic assemblies such as:
| Property | Unit | Result |
|---|---|---|
| One or Two-part | – | One |
| Color | – | Gray |
| Viscosity | cP / mPa·s / Pa·s | 100,000 / 100,000 / 100 |
| Specific Gravity (Uncured) | – | 3.5 |
| Non-Volatile Content (NVC) | % | 99.95 |
| Thermal Conductivity | W/m·K | 2.9 |
| BTU/hr-ft-°F | 1.7 | |
| Thermal Resistance at 40 psi | °C·cm²/W | 0.03 |
| Bond Line Thickness (BLT) at 40 psi | mm / inch / mils | 0.007 / 0.0003 / 0.3 |
| Electrical Properties | ||
| Dielectric Strength | volts/mil / kV/mm | 227 / 8.9 |
| Volume Resistivity | ohm·cm | 5.9E+11 |
| Dielectric Constant at 1kHz | – | 7.4 |
| Dissipation Factor at 1kHz | – | 0.0003 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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