-Item Name: DOWSIL™ TC-5121C LV Thermally Conductive Compound
-Manufacturer: Dow
-Technologies: Filled polydimethylsiloxane
-Color: Greenish yellow
-Cure Type: Non-curing
-Package Size: Contact to Techniq VN for details.
-Shelf Life: Contact to Techniq VN for details.
DOWSIL™ TC-5121C LV is a greenish-yellow, flowable, non-curing thermally conductive compound designed for heat management in electronic assemblies. The material features an optimized polymer matrix that reduces pump-out, provides low thermal resistance, and enables effective heat removal from PCB system components. It does not require curing and can achieve a thin Bond Line Thickness (BLT) for enhanced thermal performance.
| Property | Unit | Value |
|---|---|---|
| One-part or Two-part | – | One-part |
| Color | – | Greenish yellow |
| Viscosity | Pa·s / cP | 79.0 / 79,000 |
| Thixotropy | – | 1.69 |
| Specific Gravity (Uncured) | – | 4.2 |
| Non-Volatile Content (NVC) | % | 99.3 |
| Thermal Conductivity | W/m·K | 2.8 |
| Thermal Resistance @ 40 psi | °C·cm²/W | 0.09 |
| Dielectric Strength | kV/mm | 1.89 |
| Dielectric Strength | Volts/mil | 47.3 |
| Volume Resistivity | ohm·cm | 1.3E+13 |
| Dielectric Constant @ 1 kHz | – | 14.0 |
| Dissipation Factor @ 1 kHz | – | 0.073 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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