Home » Products » DOWSIL™ TC-5121C LV Thermally Conductive Compound – Adhesive/Sealant – Thermal Management

Applications

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DOWSIL™ TC-5121C LV Thermally Conductive Compound – Adhesive/Sealant – Thermal Management

-Item Name: DOWSIL™ TC-5121C LV Thermally Conductive Compound
-Manufacturer: Dow
-Technologies: Filled polydimethylsiloxane
-Color: Greenish yellow
-Cure Type: Non-curing
-Package Size: Contact to Techniq VN for details.
-Shelf Life: Contact to Techniq VN for details.

1. Product Overview

DOWSIL™ TC-5121C LV is a greenish-yellow, flowable, non-curing thermally conductive compound designed for heat management in electronic assemblies. The material features an optimized polymer matrix that reduces pump-out, provides low thermal resistance, and enables effective heat removal from PCB system components. It does not require curing and can achieve a thin Bond Line Thickness (BLT) for enhanced thermal performance.

2. Applications

Used as a thermal interface material for mid to high-end PCB system assemblies.
Helps transfer heat efficiently from electrical components to heat sinks or chassis.
Suitable for compact electronic devices with high heat generation.
Can be applied via screen printing, stencil printing, or dispensing methods.

3. Typical Properties

Property	Unit	Value
One-part or Two-part	–	One-part
Color	–	Greenish yellow
Viscosity	Pa·s / cP	79.0 / 79,000
Thixotropy	–	1.69
Specific Gravity (Uncured)	–	4.2
Non-Volatile Content (NVC)	%	99.3
Thermal Conductivity	W/m·K	2.8
Thermal Resistance @ 40 psi	°C·cm²/W	0.09
Dielectric Strength	kV/mm	1.89
Dielectric Strength	Volts/mil	47.3
Volume Resistivity	ohm·cm	1.3E+13
Dielectric Constant @ 1 kHz	–	14.0
Dissipation Factor @ 1 kHz	–	0.073

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Applications