-Item Name: DOWSIL™ TC-5288 Blue Thermal Compound
-Manufacturer: The Dow Chemical Company
-Technologies: Thermal compound formulated with thermally conductive filler in a polydimethylsiloxane matrix; flowable, solventless, non-curing
-Color: Blue
-Cure Type: Non-curing
-Package Size: Contact to Techniq VN for details.
-Shelf Life: Contact to Techniq VN for details.
DOWSIL™ TC-5288 Blue Thermal Compound is a blue, flowable, non-curing thermally conductive compound designed for efficient heat dissipation in electronic devices. It has a solventless formulation and can achieve a thin Bond Line Thickness (BLT) for optimal thermal performance. The compound has very low thermal resistance and high thermal conductivity, ensuring heat is effectively conducted away from sensitive components.
| Property | Unit | Result |
|---|---|---|
| One or Two-part | – | One |
| Color | – | Blue |
| Viscosity | cP / mPa-sec / Pa-sec | 110,000 / 110,000 / 110 |
| Specific Gravity (Uncured) | – | 3.47 |
| Non-Volatile Content (NVC) | % | 99.95 |
| Thermal Conductivity | W/m·K | 2.9 |
| Thermal Resistance (at 40 psi) | °C·cm²/W | 0.03 |
| Bond Line Thickness (at 40 psi) | mm / inch / mils | 0.007 / 0.0003 / 0.3 |
| Dielectric Strength | volts/mil / kV/mm | 227 / 8.9 |
| Volume Resistivity | ohm·cm | 6E+11 |
| Dielectric Constant (at 1 kHz) | – | 7.4 |
| Dissipation Factor (at 1 kHz) | – | 0.0003 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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