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DOWSIL™ TC-5351 Thermally Conductive Compound – Thermal Compound – Automotive Applications

-Item Name: DOWSIL™ TC-5351 Thermally Conductive Compound
-Manufacturer: The Dow Chemical Company
-Technologies: Filled with thermally conductive fillers in a siloxane polymer matrix; one-part, non-curing formulation with high thermal conductivity and vertical gap-fill capability up to 1.0 mm
-Color: Grey
-Cure Type: Non-curing
-Package Size: Contact to Techniq VN for details.
-Shelf Life: Contact to Techniq VN for details.

1. Product Overview

DOWSIL™ TC-5351 is a one-part, non-curing, thermally conductive compound formulated with thermally conductive fillers and a siloxane polymer matrix. It is designed to provide efficient heat transfer from electronic devices to heat sinks, improving overall thermal management. This grease-like silicone material offers high thermal conductivity, excellent stability on vertical surfaces, and the ability to fill vertical gaps up to 1.0 mm.

2. Applications

Power applications requiring thermal management.
Thermal interface material for heat sinks and chassis in electronic and PCB system assemblies.
Used in compact electronic devices that generate high heat.
Applied through automated or manual dispensing.

3. Typical Properties

Property	Unit	Value
One-part or Two-part	–	One-part
Color	–	Grey
Viscosity	cP / mPa·s / Pa·s	300,000 / 300,000 / 300
Thixotropy	–	2
Specific Gravity (Uncured)	–	3.1
Thermal Conductivity	W/mK	3.3
Dielectric Strength	kV/mm	6.3
Volume Resistivity	ohm·cm	3.1E+13

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