-Item Name: DOWSIL™ TC-5351 Thermally Conductive Compound
-Manufacturer: The Dow Chemical Company
-Technologies: Filled with thermally conductive fillers in a siloxane polymer matrix; one-part, non-curing formulation with high thermal conductivity and vertical gap-fill capability up to 1.0 mm
-Color: Grey
-Cure Type: Non-curing
-Package Size: Contact to Techniq VN for details.
-Shelf Life: Contact to Techniq VN for details.
DOWSIL™ TC-5351 is a one-part, non-curing, thermally conductive compound formulated with thermally conductive fillers and a siloxane polymer matrix. It is designed to provide efficient heat transfer from electronic devices to heat sinks, improving overall thermal management. This grease-like silicone material offers high thermal conductivity, excellent stability on vertical surfaces, and the ability to fill vertical gaps up to 1.0 mm.
| Property | Unit | Value |
|---|---|---|
| One-part or Two-part | – | One-part |
| Color | – | Grey |
| Viscosity | cP / mPa·s / Pa·s | 300,000 / 300,000 / 300 |
| Thixotropy | – | 2 |
| Specific Gravity (Uncured) | – | 3.1 |
| Thermal Conductivity | W/mK | 3.3 |
| Dielectric Strength | kV/mm | 6.3 |
| Volume Resistivity | ohm·cm | 3.1E+13 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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