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Thermal Management

DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler ensures reliable heat dissipation for EV electronics.

  • Item Name: DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler

  • Manufacturer: Dow

  • Technologies: Two-part silicone, thermally conductive, addition-cure

  • Color: Part A – White, Part B – Blue

  • Cure Type: Room temperature or heat accelerated cure

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: 9 months

1. Product Overview

DOWSIL™ TC-5515 LT is a low-density, two-part silicone thermally conductive gap filler with a conductivity of 2.0 W/m·K and specific gravity of 1.95. It cures at room temperature or with accelerated heat, forming a soft, compliant, and tacky elastomer that offers stress relief, vibration damping, and long-term cooling reliability. The cured material is non-flowable, holds vertical placement, and is reworkable after assembly. It provides dielectric insulation, resistance to environmental contaminants, and durability across a wide temperature range (-45 to 150°C).


2. Applications

  • Heat dissipation for EV modules and battery packs

  • Cooling for printed circuit boards and electronic devices

  • Thermal interface in assemblies exposed to vibration and cycling stresses

  • Gap filling where lightweight, reworkable, and stable thermal materials are required

3. Typical Properties

Property Condition Value
Part Type Two-part (A+B, 1:1 mix)
Color Part A: White; Part B: Blue
Viscosity Part A / Part B 150 / 120 Pa·s
Viscosity (Mixed) 10 s⁻¹ 140 Pa·s
Thixotropic Index Mixed 3.5
Working Time 25°C 90 min
Cure Time 25°C / 80°C 360 / 30 min
Specific Gravity Cured 1.95
Hardness Shore 00 65
Thermal Conductivity Hot Disk method 2.0 W/m·K
Heat Capacity 20 / 80 / 150°C 1.40 / 1.58 / 1.72 J/g·°C
Dielectric Strength 19 kV/mm
Volume Resistivity ≥1 × 10¹³ Ω·cm
Dielectric Constant / Dissipation Factor 100 kHz 3.0 / 0.0087
Lap Shear Strength (Al/Al) 0.20 MPa
Shear Modulus (DMA) 0.27 MPa
CTE -40 to 150°C 132 ppm/K
Minimum BLT 0.14 / 0.42 MPa 142 / 127 µm
Flammability UL 94 V-0
Shelf Life 25°C 9 months
Operating Temp. Range -45 to 150°C

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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