DOWSIL™ TC-5550 is a gray, thixotropic, non-curing thermally conductive compound designed for efficient heat transfer in electronic modules. It features high thermal conductivity, excellent pump-out resistance, and a solvent-free formulation for material stability. The compound enables thin bond line thickness (BLT) for better thermal performance and is screen/stencil printable for easy application.
| Property | Unit | Value |
|---|---|---|
| Before Application | ||
| Color | – | Gray |
| Material Type | – | One-part, silicone-based |
| Viscosity at High Strain (ASTM D4440-15) | Pa·s | 120–170 |
| Thixotropic Index | – | ~8 |
| Specific Gravity (ASTM D1298) | g/mL | 2.6 |
| Non-volatile Content (48 hours @ 125°C) | % | 99.96 |
| After Application | ||
| Thermal Conductivity (ISO 22007-2:2015) | W/m·K | 5.0 |
| Thermal Resistance @ 40 psi (~25 N/cm²) (ASTM D5470) | °C·cm²/W | 0.05 |
| Bond Line Thickness (BLT) @ 40 psi (~25 N/cm²) | mm (inch) | 0.02 (0.0008) |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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