DOWSIL™ TC-5550 is a gray, thixotropic, non-curing thermally conductive compound designed for efficient heat transfer in electronic modules. It features high thermal conductivity, excellent pump-out resistance, and a solvent-free formulation for material stability. The compound enables thin bond line thickness (BLT) for better thermal performance and is screen/stencil printable for easy application.
| Property | Unit | Value |
|---|---|---|
| Before Application | ||
| Color | – | Gray |
| Material Type | – | One-part, silicone-based |
| Viscosity at High Strain (ASTM D4440-15) | Pa·s | 120–170 |
| Thixotropic Index | – | ~8 |
| Specific Gravity (ASTM D1298) | g/mL | 2.6 |
| Non-volatile Content (48 hours @ 125°C) | % | 99.96 |
| After Application | ||
| Thermal Conductivity (ISO 22007-2:2015) | W/m·K | 5.0 |
| Thermal Resistance @ 40 psi (~25 N/cm²) (ASTM D5470) | °C·cm²/W | 0.05 |
| Bond Line Thickness (BLT) @ 40 psi (~25 N/cm²) | mm (inch) | 0.02 (0.0008) |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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