-Item Name: DOWSIL™ TC-5622 Thermally Conductive Compound
-Manufacturer: Dow
-Technologies: Filled polydimethylsiloxane
-Color: Gray
-Cure Type: Non-curing
-Package Size: Contact to Techniq VN for details.
-Shelf Life: Contact to Techniq VN for details.
DOWSIL™ TC-5622 is a gray, flowable, non-curing thermally conductive compound designed for efficient heat dissipation in electronic modules. It is solventless, easy to apply, and provides low thermal resistance with high thermal conductivity. The compound enhances the cooling of electronic components by acting as a thermal interface material between heat-generating devices and heat sinks or chassis.
| Property | Unit | Result |
|---|---|---|
| Color | – | Gray |
| Viscosity | cP / Pa-sec | 95,000 / 95 |
| Specific Gravity | – | 2.5 |
| Thermal Conductivity | W/m·K | 4.3 |
| Thermal Resistance (at 25 N/cm²) | °C·cm²/W | 0.06 |
| Bond Line Thickness | inch / mm | 0.0008 / 0.02 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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