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DOWSIL™ TC-5888 – Thermally Conductive Compound – Electronic and electrical component heat management applications

  • Brand Name: DOWSIL™ TC-5888 Thermally Conductive Compound

  • Package Size: Available in 1 kg cans and 140 kg drums.

  • Shelf Life: 12 months from the date of manufacture.

DOWSIL™ TC-5888 Thermally Conductive Compound is a one-part, gray, non-curing silicone-based material engineered to facilitate efficient heat dissipation in electronic components. Its thixotropic nature ensures low slump, making it ideal for applications requiring precise material placement. The solvent-free formulation maintains material stability over time, allowing for consistent performance without the need for curing.

 

Applications

This thermally conductive compound is specifically designed for:

  • Cooling modules in computer microprocessor units (MPUs)
  • Power modules
  • Other electronic components where efficient thermal transfer is essential

Its properties make it suitable for screen printing, stencil printing, and dispensing methods, ensuring versatility in various manufacturing processes.

 

DOWSIL™ TC-5888 Thermally Conductive Compound

Typical Properties

Property Unit Value
Color Gray
One-Part Material Non-curing
Viscosity at Low Strain Rate Pa·s 1,200
Viscosity at High Strain Rate Pa·s 100
Specific Gravity 2.6
Volatile Content (48 hours at 125°C) % 0.02
Thermal Conductivity W/m·K 5.2
Thermal Resistance at 25 N/cm² °C·cm²/W 0.05
Bond Line Thickness at 25 N/cm² mm (inch) 0.02 (0.0008)

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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