DOWSIL™ TC-6011 Thermally Conductive Encapsulant:

1. Features & Benefits

1. High Thermal Conductivity

   • Formulated to dissipate heat efficiently from sensitive components, helping prolong device life and reliability.

2. Two‐Part Silicone Encapsulant

   • Mixes Part A and Part B in a specified ratio; cures to form a durable, flexible elastomer that provides both thermal management and environmental protection.

3. Low Viscosity for Easy Flow

   • Flows around complex shapes or dense circuitry with minimal voids, ensuring uniform coverage.

4. Strong Dielectric Properties

   • Once cured, the material provides excellent electrical insulation, which is important for high‐voltage or sensitive electronic applications.

5. Robust Environmental Resistance

   • Resists moisture, vibration, and temperature extremes, supporting consistent performance in harsh environments.

2. Applications

1. Power Electronics

   • Encapsulating high‐power modules, inverters, or converters to facilitate heat transfer and protect components from shock and contaminants.

2. Automotive & Transportation

   • Helps manage heat in electric vehicle battery packs, ECUs, or other control modules exposed to wide temperature swings.

3. LED Lighting

   • Used for LED drivers, power supplies, or other assemblies where thermal management is crucial for longevity and light output.

4. Industrial Equipment

   • Protects motor controllers, sensors, and power distribution units operating in environments with dust, humidity, or mechanical stress.