DOWSIL™ TC-6020 Thermally Conductive Encapsulant is a two‑part, heat‑cure silicone encapsulant from Dow designed to encapsulate electronic assemblies and dissipate heat effectively.
Available Sizes: 1 kg and 5 kg cans.
Shelf Life: Approximately 36 months (3 years) from the date of manufacture.
DOWSIL™ TC-6020 Thermally Conductive Encapsulant:
High Thermal Conductivity
Two‐Part Silicone Encapsulant
Moderate Viscosity & Flow
Reliable Dielectric Protection
Environmental Durability
Power Electronics & Modules
Automotive & E-Mobility
LED Lighting Assemblies
Industrial Control Systems
DOWSIL™ TC-6020 Thermally Conductive Encapsulant:
| Property | Typical Value / Range |
|---|---|
| Appearance (Mixed) | Gray, flowable liquid |
| Viscosity (Mixed) | Moderate (e.g., a few thousand mPa·s) |
| Mix Ratio (A : B) | Typically 1 : 1 by weight (check datasheet) |
| Work Life / Pot Life | Several hours at 25 °C (varies by conditions) |
| Cure Conditions | e.g., 30 min at 100 °C or 24 hrs at 25 °C |
| Hardness (Shore A) | ~40–60 (after full cure) |
| Thermal Conductivity | ~2.0–2.5 W/m·K (approx. range) |
| Dielectric Strength | ~20–25 kV/mm |
| Volume Resistivity | ~10¹⁴ Ω·cm |
| Service Temperature | –40 °C to +150 °C (typical) |
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