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Thermal Management

DOWSIL™ TC-6032 – Two-part thermally conductive silicone encapsulant for PCB, EV, inverter, transformer, electronics

  • Item Name: DOWSIL™ TC-6032 Thermally Conductive Encapsulant

  • Manufacturer: The Dow Chemical Company

  • Technologies: Two-part addition-cure silicone elastomer with thermally conductive fillers

  • Color: Part A – White, Part B – Blue, As Mixed – Contact to Techniq VN for details.

  • Cure Type: Heat cure

  • Package Size: 20 L pail

  • Shelf Life: Contact to Techniq VN for details

1. Product Overview

DOWSIL™ TC-6032 is a two-part (1:1), flowable, thermally conductive silicone elastomer designed for encapsulating sensitive electronic components. It offers heat dissipation, self-leveling flow, and versatility in heat curing. The material cures to form an elastic, thermally conductive rubber suitable for deep-section and confined cures, with no by-products from the curing process. It maintains performance over a wide temperature range and exhibits resistance to minimal solvent exposure.


2. Applications

  • On-board chargers

  • Inverters / converters

  • Transformers

  • Other electronic and electrical components requiring thermal management

Application Methods: Automated or manual mixing and dispensing.

3. Typical Properties

Not Mixed (Part A / Part B)

Property Unit Part A Part B
Color White Blue
Viscosity mPa·s 8,000 4,000
Specific Gravity at 25°C 2.73 2.73

After Mixed (1:1 by weight)

Property Unit Result
Viscosity mPa·s 6,500
Heat Cure Time min 80°C: 60; 100°C: 30; 120°C: 20
Pot Life (Working Time) at 25°C hour 4
Specific Gravity, Cured at 25°C 2.75
Hardness, Shore A 34
Adhesion Strength on Al MPa 80°C: 0.38; 100°C: 0.38; 120°C: 0.44
Thermal Conductivity at 25°C W/m·K 3.2
Tensile Strength MPa 0.5
Elongation % 45
Shear Modulus by DMA at 25°C MPa 1.55
Dielectric Strength kV/mm 18
Volume Resistivity Ohm·cm 1.3 × 10¹⁴
Dielectric Constant 100 Hz: 3.22; 100 kHz: 3.66
Dissipation Factor 100 Hz: 0.0029; 100 kHz: 0.0023
Coefficient of Thermal Expansion (CTE) -40 to 150°C ppm/K 80
Volatile Siloxane Contents (D4–D10) ppm <100
UL 94 Flammability V-0

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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