Item Name: DOWSIL™ TC-6040 Thermal Conductive Encapsulant
Manufacturer: The Dow Chemical Company
Technologies: Two-part addition-cure silicone with thermally conductive fillers
Color: Part A – White, Part B – Pink, As Dispensed – Pink
Cure Type: Room temperature or heat accelerated
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.
DOWSIL™ TC-6040 is a two-part, flowable silicone encapsulant with a 1:1 mix ratio, designed for both room temperature and heat-accelerated curing. It provides high thermal conductivity (4.0 W/m·K), excellent flow (self-leveling), minimal filler settling, and long-term stability up to +150°C, with short-term tolerance up to +200°C. The material is suitable for electrical and electronic assemblies requiring thermal management, durability, and flame resistance.
LED and lighting assemblies
EV controllers and on-board chargers
Energy conversion modules
Inverters and converters
Control units
Power supplies and electronic modules
| Property | Unit | Result |
|---|---|---|
| One or Two Part | – | Two |
| Mix Ratio (A:B) | – | 1:1 |
| Color Part A | – | White |
| Color Part B | – | Pink |
| Specific Gravity | – | 3.05 |
| Viscosity (Part A) | cP | 26,000 |
| Viscosity (Part B) | cP | 22,000 |
| Property | Unit | Result |
|---|---|---|
| Color as Dispensed | – | Pink |
| Viscosity | cP | 25,000 |
| Working Life at 25°C | minutes | 90 |
| Cure Time at 25°C | hours | 24 |
| Cure Time at 100°C | minutes | 60 |
| Durometer Shore A | – | 32 |
| Tensile Strength | MPa | 0.26 |
| Elongation | % | 10 |
| Unprimed Lap Shear to AlClad | MPa | 0.10 |
| Dielectric Strength | kV/mm | 15 |
| Volume Resistivity | ohm·cm | ≥ 1×10¹³ |
| Dielectric Constant (100 kHz) | – | 4.13 |
| Dissipation Factor (100 kHz) | – | 0.018 |
| CTE | ppm/°C | 100 (-40 to 150°C) |
| Thermal Conductivity | W/m·K | 4.0 |
| Heat Capacity (25°C/100°C/150°C) | J·g⁻¹·°C⁻¹ | 0.90 / 1.09 / 1.22 |
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