1. Product Overview

DOWSIL™ TC-8225 is a two-part silicone-based thermally conductive gap filler with a thermal conductivity of 2.7 W/m·K. It cures at room temperature or under heat to form a soft, compressible elastomer designed for long-term reliability in thermal management. The product withstands continuous operation up to 150°C and short-term exposure up to 200°C. Incorporating glass beads (~180 µm) for controlled thickness, it provides reliable gap filling, dielectric insulation, stress relief, and environmental protection. Its stable performance across temperature cycling makes it ideal for high-demand electronic applications.

2. Applications

• Thermal management for PCB system assemblies

• Effective heat dissipation between PCB devices and aluminum housings

• Designed for automated dispensing with meter-mix equipment

• Suitable for devices requiring shock absorption, vibration damping, and insulation