Applications

Elan-tron® MC 5611 RC + Hardener 43 – Highly flexible, filled epoxy system for electrical and electronic potting

Item Name: Elan-tron® MC 5611 RC + Hardener 43

Manufacturer: ELANTAS Beck India Ltd.

Technologies: Room temperature curing, filled epoxy, flexible, low shrinkage, thermal shock resistant, water and chemical resistant

Color: Resin – Black filled, Hardener – Dark brown to orange

Cure Type: Room temperature 12–16 h + 4–6 h at 80–100°C or alternative schedule at 60–65°C + RT

Package Size: Resin – 25 kg open mouth polybucket; Hardener – 25 kg polycontainer

Shelf Life: Resin – 6 months; Hardener – 12 months

1. Product Overview

Elan-tron® MC 5611 RC combined with Hardener 43 is a filled, room-temperature-curing epoxy system engineered for potting and encapsulation of electrical and electronic components. It features medium viscosity, high flexibility, and excellent adhesion to diverse substrates. The system offers void-free encapsulation, low shrinkage, strong resistance to thermal shock, water, and chemicals, as well as enhanced crack resistance. With RoHS 3.0 and REACH compliance, it delivers both reliability and environmental safety, making it suitable for robust protection of sensitive electrical assemblies.


2. Applications

This system is ideal for potting, sealing, and encapsulating small to medium-sized electrical and electronic devices. It is widely used in auto electrical components, filters, capacitors, flashers, and PCB assemblies. Its flexibility and resistance to mechanical and environmental stresses also make it suitable for devices requiring vibration damping and reliable long-term performance.

3. Typical Properties

Not Mixed Components

Property Resin (MC 5611 RC) Hardener 43
Appearance Black filled epoxy resin Dark brown–orange liquid
Viscosity at 25°C (mPa·s) 8000–14000 300–700
Density at 25°C (g/ml) 1.26–1.46 0.97 ±0.1
Flash Point (°C) >100 >100
Shelf Life (months) 6 12

Mixed System & Processing

Property Value
Mixing Ratio (by weight) 100:20 ±1.5
Initial Viscosity at 25°C ~4000 mPa·s
Pot Life at 25°C 200–240 min
Gel Time at 25°C (240 g mix) 220–260 min
Curing Cycle (option 1) 12–16 h at RT + 4–6 h at 80–100°C
Curing Cycle (option 2) 1–2 h at 60–65°C + 12 h at RT

Cured Properties

Property Value
Density (25°C) 1.30 ±0.1 g/cm³
Hardness 55–70 Shore A
Tensile Strength 1.7 MPa
Elongation at Break 46%
Flexural Strength Flexible
Thermal Conductivity 0.46 W/m·K
Glass Transition Temperature 5–15 °C
Coefficient of Thermal Expansion 75–95 ×10⁻⁶ /°C (below Tg); 180–200 ×10⁻⁶ /°C (above Tg)
Dielectric Strength 16 kV/mm
Volume Resistivity 1 ×10¹² Ω·cm
Dielectric Constant (1 kHz, 30 V) Not Tested
Tracking Resistance >600 V
Water Absorption (24h) ≤0.3%
Chemical Resistance Stable in 25% H₂SO₄ and 5% NaOH

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