• Item Name: Elan-tron® MC 5611 RC + Hardener 43
• Manufacturer: ELANTAS Beck India Ltd.
• Technologies: Room temperature curing, filled epoxy, flexible, low shrinkage, thermal shock resistant, water and chemical resistant
• Color: Resin – Black filled, Hardener – Dark brown to orange
• Cure Type: Room temperature 12–16 h + 4–6 h at 80–100°C or alternative schedule at 60–65°C + RT
• Package Size: Resin – 25 kg open mouth polybucket; Hardener – 25 kg polycontainer
• Shelf Life: Resin – 6 months; Hardener – 12 months
Elan-tron® MC 5611 RC combined with Hardener 43 is a filled, room-temperature-curing epoxy system engineered for potting and encapsulation of electrical and electronic components. It features medium viscosity, high flexibility, and excellent adhesion to diverse substrates. The system offers void-free encapsulation, low shrinkage, strong resistance to thermal shock, water, and chemicals, as well as enhanced crack resistance. With RoHS 3.0 and REACH compliance, it delivers both reliability and environmental safety, making it suitable for robust protection of sensitive electrical assemblies.
This system is ideal for potting, sealing, and encapsulating small to medium-sized electrical and electronic devices. It is widely used in auto electrical components, filters, capacitors, flashers, and PCB assemblies. Its flexibility and resistance to mechanical and environmental stresses also make it suitable for devices requiring vibration damping and reliable long-term performance.
| Property | Resin (MC 5611 RC) | Hardener 43 |
|---|---|---|
| Appearance | Black filled epoxy resin | Dark brown–orange liquid |
| Viscosity at 25°C (mPa·s) | 8000–14000 | 300–700 |
| Density at 25°C (g/ml) | 1.26–1.46 | 0.97 ±0.1 |
| Flash Point (°C) | >100 | >100 |
| Shelf Life (months) | 6 | 12 |
| Property | Value |
|---|---|
| Mixing Ratio (by weight) | 100:20 ±1.5 |
| Initial Viscosity at 25°C | ~4000 mPa·s |
| Pot Life at 25°C | 200–240 min |
| Gel Time at 25°C (240 g mix) | 220–260 min |
| Curing Cycle (option 1) | 12–16 h at RT + 4–6 h at 80–100°C |
| Curing Cycle (option 2) | 1–2 h at 60–65°C + 12 h at RT |
| Property | Value |
|---|---|
| Density (25°C) | 1.30 ±0.1 g/cm³ |
| Hardness | 55–70 Shore A |
| Tensile Strength | 1.7 MPa |
| Elongation at Break | 46% |
| Flexural Strength | Flexible |
| Thermal Conductivity | 0.46 W/m·K |
| Glass Transition Temperature | 5–15 °C |
| Coefficient of Thermal Expansion | 75–95 ×10⁻⁶ /°C (below Tg); 180–200 ×10⁻⁶ /°C (above Tg) |
| Dielectric Strength | 16 kV/mm |
| Volume Resistivity | 1 ×10¹² Ω·cm |
| Dielectric Constant (1 kHz, 30 V) | Not Tested |
| Tracking Resistance | >600 V |
| Water Absorption (24h) | ≤0.3% |
| Chemical Resistance | Stable in 25% H₂SO₄ and 5% NaOH |
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