Applications

Accessories
Adhesives
Cleaners
Equipment
Lubricants
Others
Primer, Activator
Solder Materials
Solvent
Tapes
Technology
Thermal Management

ELAN-Tron® SE 6973 LS6973-092 – Transparent silicone-modified epoxy protective coating for PCBs and electronics

Item Name: ELAN-Tron® SE 6973 LS6973-092

Manufacturer: ELANTAS PDG, Inc.

Technologies: Solvent-borne, silicone-modified epoxy resin solution

Color: Transparent

Cure Type: Air-drying, optional post-cure at 80°C / 175°F for 30 minutes

Package Size: Contact to Techniq VN for details.

Shelf Life: 12 months

1. Product Overview

ELAN-Tron® SE 6973 LS6973-092 is a transparent, solvent-borne, silicone-modified epoxy resin solution. It is designed as a conformal coating for electronic assemblies, offering high thermal stability, excellent air release, strong substrate wetting, and UV fluorescence for inspection. The product complies with MIL-I-46058C (Type ER & SR) and IPC-CC-830B Type ER, ensuring reliability for critical applications.


2. Applications

  • Protective coating for printed circuit boards (PCBs).

  • Encapsulation of discrete electronic devices.

  • Applied by dip coating or spray (airless / air-assisted).

3. Typical Properties

Property Conditions Value Units
As Supplied (Unmixed)
Viscosity 25°C 80 – 200 cP
Non-Volatile Content 1.5 g – 1 h – 110°C 38 – 40 %
Weight per Gallon 25°C 7.9 – 8.1 lb
Flash Point ASTM D93 17 / 62 °C / °F
VOC Content ASTM D3960 4.1 lb/gal
Viscosity Reducer ELAN-Plus™ BS-327
After Cure
Dry-to-touch Room temp ~15 minutes
Full Cure 16 – 24 h at RT OR 30 min at 80°C
Dielectric Strength ASTM D149, 1.4 mils – 25°C 3600 V/mil
Dielectric Strength (after 24h in water) ASTM D149, 25°C 1250 V/mil
Surface Insulation Resistance IPC TM-650-2.6.3.3, 1000 h at 85°C/85% RH 370

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

RELATED PRODUCT

Contact Technical Support

Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.

(+84) 889 901 929

Email: info@techniq.vn

Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).

For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.