Applications

ELAN-Tron® U 510S-6 Black Thixo / UH 510S – Two-component polyurethane potting and sealing for electronics

Item Name: ELAN-Tron® U 510S-6 Black Thixo / UH 510S

Manufacturer: ELANTAS PDG, Inc.

Technologies: Two-component, 100%-solids polyurethane, room temperature curing, thixotropic

Color: Resin – Black, Hardener – Amber

Cure Type: Room temperature or low temperature cure

Package Size: Contact to Techniq VN for details.

Shelf Life: 9 months

1. Product Overview

ELAN-Tron® U 510S-6 Black Thixo / UH 510S is a two-component, 100% solids polyurethane potting compound designed for electrical and electronic equipment. It cures at room or low temperature, offers excellent adhesion to plastics and metals, and remains flexible down to -40°C and below. The thixotropic nature enables controlled application without sagging. It demonstrates strong resistance to hydrolysis (85°C / 85% R.H.), good thermal shock resistance, and is suitable for Class 120 service.


2. Applications

  • Potting and sealing of electrical and electronic devices

  • Encapsulation requiring hydrolysis resistance and thermal shock performance

  • Applications needing room-temperature or accelerated low-temperature curing

  • Use in meter-mix bench and vacuum casting processes

3. Typical Properties

Before Mixing

Property Resin U 510S-6 Hardener UH 510S Notes
Viscosity (25°C) 10,000–13,000 cP 65–85 cP High resin viscosity, low hardener
Colour Black Amber Easy identification
Weight per gallon (25°C) 7.6–7.9 lb 10.0–10.4 lb Density difference
Flash Point >94°C (>201°F) >94°C (>201°F) Safe handling
Mix Ratio (by weight) 100 24 Standard
Mix Ratio (by volume) 100 18.2

After Mixing

Property Value Notes
Mixed Viscosity (25°C) 6,500–8,500 cP Good flowability
Gel Time (25°C) 4–8 min Fast reaction
VOC <0.1 lb/gal Environmentally safe
Cure Schedule 72 h @ 25°C – or – 2 h @ 80°C Flexible curing options

Cured Properties

Property Value Notes
Shore Hardness (25°C) A 50–60 Flexible cured resin
Tensile Strength 210 psi Moderate strength
Thermal Conductivity 0.2 W/m·K Low heat conduction
Glass Transition Temp. < -60°C Highly flexible at low T
CTE (above Tg) 200 ppm/°C Controlled expansion
Dielectric Strength 400 V/mil Strong insulation
Volume Resistivity 1×10¹⁵ Ω·cm Excellent electrical resistance
Dielectric Constant (1 kHz) 3.5 Stable insulation
Dissipation Factor (1 kHz) 0.04 Low dielectric loss

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