• Item Name: EPIBOND® 115 A/B
• Manufacturer: Huntsman
• Technologies: Epoxy, Structural & Syntactic Adhesive
• Color: Off white
• Cure Type: 1 h at 150-158°F + 3-5 h at 200-275°F or 1 h at 210-220°F + 1 h at 250-260°F
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
EPIBOND® 115 A/B is a two-component (2K), heat-curing epoxy structural adhesive designed for service temperatures up to 149°C (300°F). It bonds metals and composites with high strength, maintaining performance in high-stress areas due to integrated 5 mil (125 μm) spacer beads for uniform bond lines. The adhesive is thixotropic, toughened for vibration resistance, and suitable for aerospace structural components. It has excellent chemical and environmental resistance, gap-filling capabilities, and a long working time to accommodate larger assemblies. Mix ratio is 2:1 by volume.
Aerospace structural bonding
Metal and composite bonding
Liquid shim / gap-filling applications
Structural components requiring high shear, peel, and vibration resistance
Before Mixing / After Mixing
| Property | Test Method | Value (Before Mixing) | Value (After Mixing) |
|---|---|---|---|
| Physical Form | – | Paste | Paste |
| Density | ASTM D1875 | 1.12 g/cm³ | 1.12 g/cm³ |
| Gel Time | – | – | >180 min at 25°C, 100 g |
| Mix Ratio | – | 2:1 by volume | 2:1 by volume |
| Tensile Lap Shear, Aluminum | ASTM D1002 | – | 25°C: 32.7 MPa; 93°C: 27.4 MPa; 177°C: 6.4 MPa; -65°C: 31.2 MPa |
| T-Peel Strength | ASTM D1867 | – | 1.75 N/mm at 25°C |
| Dry Tg as Cured | ASTM D-7028 | – | 128°C (295°F) |
| Wet Tg (42-day, 145°F, 85% RH) | ASTM D-7028 | – | 123°C (253°F) |
| Tensile Strength | ASTM D-638 | – | 34.5 MPa at 25°C |
| Flexural Strength | ASTM D-790 | – | 75.9 MPa at 25°C |
| Compressive Strength | ASTM D-695 | – | 89.7 MPa at 25°C |
| Bondline Thickness Effect | – | – | 0.01 in: 32.7 MPa; 0.02 in: 27.6 MPa; 0.04 in: 20.7 MPa; 0.08 in: 13.8 MPa |
| Handling Strength | – | – | 16 h RT: 5.0 MPa; 1 h at 68°C: 25.7 MPa; 1 h 68°C + 5 h 93°C: 32.7 MPa |
| Typical Cure Cycle | – | – | 1 h at 65–70°C + 3–5 h at 93–135°C or 1 h at 99–105°C + 1 h at 121–127°C |
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