• Item Name: EPIC S7174-03
• Manufacturer: Epic Resins
• Technologies: Two-component epoxy potting and casting compound
• Color: Black (mixed)
• Cure Type: Room temperature or accelerated heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
S7174-03 is a two-component epoxy potting and casting system recognized for UL 94 V-0 flammability rating. It offers low viscosity for effective flow into tight spaces, minimal shrinkage, excellent adhesion, and high Shore D hardness. Withstanding continuous use at up to 130 °C and short durations above that, it ensures long-term stability with low water absorption and weight loss. Its balanced performance makes it reliable for high-temperature and protective potting applications.
Surge protectors
Transformers
Livestock heater coil encapsulation
Switch encapsulation
Motor and stator windings
| Property | Unit | Value / Range |
|---|---|---|
| Mix Ratio (by weight / volume) | – | 5:1 / 3:1 |
| Viscosity @ 25 °C (Mixed) | cps | ≤ 4,000 |
| Weight per Gallon (Mixed) | lb/gal | 11.90 – 12.30 |
| Gel Time (100 g @ 25 °C) | min | 45 – 55 |
| Cure Schedule | – | 7 days @ 25 °C; Alt.: 6–8 h @ 25 °C + 2 h @ 65 °C |
| Hardness (ASTM D2240) | Shore D | 82 – 88 |
| Glass Transition (Tg, ASTM E1545) | °C | 36 – 40 |
| Coeff. Thermal Expansion (ASTM E831) | 10⁻⁶/°C | 70 – 75 (below Tg); 165 – 175 (above Tg) |
| Tensile Strength (ASTM D412) | psi | 3,000 – 3,200 |
| Elongation (ASTM D412) | % | 18 – 19 |
| Thermal Conductivity | W/m·K | 0.49 – 0.50 |
| Dielectric Strength (ASTM D149) | Volts/mil | 700 – 730 @ 0.052 in; 420 – 450 @ 0.114 in |
| Dielectric Constant (ASTM D150) | – | 3.9–4.1 @100 Hz; 3.5–3.7 @100 kHz |
| Dissipation Factor (ASTM D150) | – | 0.035–0.040 @100 Hz; 0.018–0.022 @100 kHz |
| Volume Resistivity (ASTM D257) | ohm·cm | 2.0×10¹⁴ – 4.0×10¹⁴ |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.