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Epic Resins S7397-03 – Epoxy Potting Compound – Electronics, sensors, power supplies, lighting ballasts, control modules

Item Name: EPIC S7397-03
Manufacturer: Epic Resins
Technologies: Two-component epoxy potting compound
Color: Part A – Black, Part B – Opaque, Mixed – Black/Gray
Cure Type: Ambient cure (48–50 hours @ 25˚C) or heat cure (4–5 hours @ 65˚C)
Package Size: Contact to Techniq VN for details.
Shelf Life: 12 months

1. Product Overview

Epic S7397-03 is a two-component epoxy potting compound designed to provide maximum protection for electronic assemblies in demanding environments. It is RoHS compliant, UL 94 V-0 rated at 3.2 mm, and offers long pot life, medium viscosity, high durometer, and excellent thermal conductivity. With a smooth non-blush surface finish, it ensures both mechanical durability and reliable insulation.


2. Applications

  • Battery chargers

  • Lighting ballasts

  • Sensors

  • Control modules

  • Power supplies

3. Typical Properties

Property Unit Part A Part B Mixed / Cured
Color Black Opaque Black/Gray
Mix Ratio 100:100 (by weight), 1:1 (by volume)
Viscosity @ 25 °C cps 11,000–18,000 6,000–10,000 7,000–9,000
Weight per Gallon lb/gal 13.25–13.45 13.70–13.95 13.47–13.70
Gel Time min 200–300 @ 25 °C
Cure Schedule h 48–50 @ 25 °C; 4–5 @ 65 °C
Hardness Shore D 70–72
Glass Transition (Tg) °C 24–28
Thermal Conductivity W/mK 1.04–1.06
Lap Shear Strength psi 1500–1600
Tensile Strength psi 800–900
Water Absorption % 1.03 (24 h), 3.31 (168 h)
Dielectric Strength V/mil >435
Volume Resistivity ohm·cm 1.21e+13 – 1.33e+13

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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