• Item Name: EA6033
• Manufacturer: H.B. Fuller
• Technologies: Polyurethane Acrylate
• Color: Semi-translucent paste
• Cure Type: UV light (365nm)
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
EA6033 is a fast UV-curable adhesive designed for bonding a wide variety of substrates, including glass, many plastics, and most metals. It is a one-component system requiring no mixing, offering good flexibility and strong adhesion. The product is suitable for applications such as BGA reinforcement.
Key Features & Benefits:
One-component, no mixing required
Fast curing under UV light
Strong adhesion to glass, plastics, and metals
Flexible cured material
Bonding glass, plastics, and metals
BGA (Ball Grid Array) reinforcement
Electronics assembly where UV curing is feasible
Instructions for Use:
Ensure surfaces are clean and free from contaminants.
Use a 365 nm UV lamp focused on the adhesive-coated surface.
Adjust curing speed based on UV intensity, distance, and coating thickness.
Close the lid immediately after use and use a black hose for dispensing.
Store away from sunlight and UV/artificial light sources.
Storage:
Temperature: 8℃ to 28℃ in unopened container
Shelf life: 12 months
Health & Safety:
Use in well-ventilated areas
Avoid skin/eye contact; rinse with water if contact occurs
Keep out of reach of children
| Property | Value (Uncured) | Value (Cured, 100mW/cm² @ 365 nm, 24s) |
|---|---|---|
| Appearance | Semi-translucent paste | – |
| Component | Polyurethane Acrylate | – |
| Viscosity (25℃, CP52, 10 rpm) | 10,000 cps | – |
| TI | 4.1 | – |
| Density (g/cm³) | 1.05 | – |
| Tacky free time | – | <6 s |
| Depth of cure | – | 8 mm @ 24 s |
| Hardness (Shore D) | – | 65 |
| Tensile strength at break (MPa) | – | 14 |
| Elongation at break (%) | – | 255 |
| Lap shear strength, PC/PC (MPa) | – | 12 |
| Lap shear strength, PC/FR4 (MPa) | – | 6 |
| Surface resistivity | – | 8×10¹⁴ Ω |
| Volume resistivity | – | 8×10¹⁴ Ω·cm |
| Dielectric breakdown strength (kV/mm) | – | 22 |
| Dielectric constant / Dissipation factor (1 MHz) | – | 4.2 / 0.03 |
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