Applications

H.B. Fuller Tonsan®1521 – Two-component black silicone adhesive for room-temperature potting of electronic components in PV modules

Item Name: 1521
Manufacturer: H.B. Fuller
Technologies: Two-component silicone adhesive
Color: Black
Cure Type: Room temperature cure
Package Size: Contact Techniq VN for details
Shelf Life: 6 months

1. Product Overview

1521 (Black) is a two-component silicone-based adhesive designed for fast room-temperature curing, providing excellent sealing and bonding. It is typically used for potting electronic components, especially in junction boxes on PV modules. The adhesive features easy handling due to a 6:1 mixing ratio, excellent adhesion, electrical performance, and resistance to hot and damp conditions.

Key Features & Benefits:

  • Fast cure at room temperature with deep section cure.

  • Easy handling due to 6:1 mixing ratio.

  • Excellent adhesion to various substrates.

  • Suitable for automated dispensing.

  • Excellent electrical performance.

  • Excellent resistance to hot damp conditions.

Type of Product: Adhesive
Components: Two-component
Curing: Room temperature
Appearance/Color: Black
Consistency: Viscous Liquid
Shelf Life: 6 months from manufacture


2. Applications

  • Potting of electronic components.

  • Junction boxes on PV modules.

  • Automated dispensing applications requiring high electrical insulation and sealing performance.

3. Typical Properties

A. Before Mixing

Property Value Test Method / Condition
Viscosity (Resin) 13,000 mPa·s GB/T 2794
Viscosity (Activator) 25 mPa·s GB/T 2794
Flash Point >93℃ GB/T 5208

B. After Mixing (Volumetric 4:1 / Weight 6:1)

Property Value Test Method / Condition
Viscosity (Mixed) 3,000 mPa·s GB/T 2794
Mixed Density 1.40 g/cm³ GB/T 13354
Working Time 8 minutes GB/T 5208
Gel Time 60 minutes GB/T 5208

Cured Mechanical Properties

Property Value Test Method
Hardness 40 Shore A GB/T 531
Tensile Strength 1.2 MPa GB/T 528
Elongation at Break 110% GB/T 528

Thermal & Electrical Properties

Property Value Test Method
Thermal Service Range –50 to 150℃
Thermal Conductivity 0.30 W/m·K DIN EN 821
Volume Resistivity 1.0×10¹⁵ Ω·cm GB/T 1692
Breakdown Strength 23 kV/mm GB/T 1695

Damp-Heat Aging (85℃, 85% RH, 1000h)

Property Value Test Method
Volume Resistivity 1.0×10¹⁵ Ω·cm GB/T 1692

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