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H.B. Fuller URALITE FH1270 – Two-component polyurethane electrical protective coating for printed circuit assemblies insulation

  • Item Name: URALITE FH1270

  • Manufacturer: H.B. Fuller

  • Technologies: Two-component Thermosetting Polyurethane

  • Color: Part A – Yellow, Part B – Colorless

  • Cure Type: Thermal/Room Temperature Cure

  • Package Size: Contact to Techniq VN for details.

  • Shelf Life: 12 months

1. Product Overview

URALITE FH1270 is a two-component, high-solids, thermosetting polyurethane electrical protective coating. It is non-toxic and designed as an insulating compound for coating printed circuit assemblies. FH1270 conforms to Raytheon’s HMS #16-1847 Rev. L, Type II, Class 1, and is suitable for high-solids brush applications.


2. Applications

  • Insulating coating for printed circuit assemblies

  • Protective coating for electrical and electronic components

  • Suitable for applications requiring high dielectric strength and chemical resistance

3. Typical Properties

Property Part A Part B Blend Test Method / Condition
Blending Ratio (by weight) 66 100
Color Yellow Colorless Yellow
Density (lb/gal) 7.91 9.4 8.75 ASTM D0792
Gel Time (83 g, 23°C) >6 h
Odor Ester-like solvent
Shelf Life 12 months 12 months
Solid Content (non-volatiles) 75% 60% TMWB052
Specific Gravity 0.95 1.13 D792/D1475
Tack-Free Time (93°C) 25–30 min TMTS074
Viscosity (25°C) 500 cP 300 cP 300 cP TMTS001
Viscosity Flow Index (Zahn #2) 36–44 s TMSC077
Dielectric Strength 579 V/mil
Dielectric Constant at 1 MHz 3.26
Dissipation Factor at 1 MHz 0.021
Volume Resistivity 1.9×10¹⁶ Ω·cm
Surface Resistivity 8.22×10¹⁶ Ω

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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