HumiSeal® 1A20 is a single-component, chemically resistant, fast-curing polyurethane conformal coating. It fluoresces under UV light for inspection and meets MIL-I-46058C, IPC-CC-830, and RoHS Directive 2002/95/EC standards. The product is UL-recognized under File Number E105698.
| Property | Value |
|---|---|
| Density | 1.02 ± 0.02 g/cm³ |
| Solids Content | 50 ± 3% |
| Viscosity | 100 ± 30 cP |
| VOC | 511 g/L |
| Recommended Coating Thickness | 25 – 75 µm |
| Drying Time to Handle | 60 minutes |
| Recommended Curing | 24 hrs @ RT or 3 hrs @ 76°C |
| Time to Reach Optimum Properties | 7 days |
| Shelf Life | 6 months at RT |
| Property | Value |
|---|---|
| Thermal Shock Resistance | -65°C to 125°C |
| Coefficient of Thermal Expansion | 515 ppm/°C |
| Glass Transition Temperature (Tg) | 71°C |
| Modulus (DMA) | 89.6 MPa |
| Flammability (UL94) | V-0 |
| Dielectric Withstand Voltage | >1500V |
| Dielectric Constant (1MHz, 25°C) | 3.5 |
| Dissipation Factor (1MHz, 25°C) | 0.028 |
| Insulation Resistance | 3.0 x 10¹⁴ Ω |
| Moisture Insulation Resistance | 4.8 x 10¹⁰ Ω |
| Fungus Resistance | Passes |
| Chemical Resistance | Excellent |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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