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Thermal Management

HumiSeal® 1B31 LTX – Acrylic Conformal Coating – Moisture & Corrosion Protection

-Item Name: HumiSeal® 1B31 LTX
-Manufacturer: HumiSeal
-Technologies: Acrylic Conformal Coating
-Color: Not specified
-Cure Type: 24 hrs at room temperature or 30 min at 76°C
-Package Size: Contact to Techniq VN for details.
-Shelf Life: 24 months

1. Product Overview

HumiSeal® 1B31 LTX is a fast-drying, single-component acrylic conformal coating designed to protect electronic assemblies from moisture, corrosion, and contaminants. It is formulated with reduced xylene and toluene concentration, ensuring compliance with GB30981-2020 VOC standards. The product is available in various pre-blended formulations, eliminating the need for further dilution.

2. Applications

  • Protection of PCBs and electronic components from environmental stress.
  • Used in automated spray and film coating systems.
  • Suitable for applications requiring low moisture vapor permeability and easy inspection under UV light.

3. Typical Properties

Property Before Mixing (Pre-Blended Products)
Viscosity (CPS) 65 – 200 ± 15
Solids Content (%) 23.5 – 35 ± 3
Density (g/cm³) 0.87 – 0.92 ± 0.02
VOC Content (g/L) 592 – 689
Property After Mixing / Cured
Recommended Coating Thickness 25 – 75 microns
Drying Time to Handle 10 minutes
Curing Conditions 24 hrs @ RT or 30 min @ 76°C
Time to Reach Optimum Properties 7 days
Thermal Shock Resistance -65°C to 125°C
Glass Transition Temperature (Tg) 14°C
Dielectric Withstand Voltage >1500V
Dielectric Breakdown Voltage 7500V
Insulation Resistance 8.0 × 10¹⁴ ohms (800TΩ)
Moisture Insulation Resistance 6.0 × 10¹⁰ ohms (60GΩ)

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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