– Item Name: HumiSeal® 1B73
– Manufacturer: HumiSeal
– Technologies: Single-component, fast-drying acrylic conformal coating
– Color: Not specified
– Cure Type: 24 hrs at room temperature or 2 hrs at 76°C
– Package Size: Contact to Techniq VN for details.
– Shelf Life: 24 months
HumiSeal® 1B73 is a fast-drying, single-component acrylic conformal coating designed for printed circuit assemblies (PCBs). It offers excellent flexibility, electrical insulation, and UV fluorescence for inspection. The product complies with MIL-I-46058C, IPC-CC-830, UL (File E105698), and RoHS Directive 2011/65/EU. It is easily repairable and can be applied through dipping, spraying, or brushing.
| Property | Value | Test Method |
|---|---|---|
| Density | 0.92 ± 0.02 g/cm³ | ASTM D1475 |
| Solids Content | 29.5 ± 2% | Fed-Std-141, Method 4044 |
| Viscosity | 250 ± 20 cPs | Fed-Std-141, Method 4287 |
| VOC | 661 g/L | – |
| Shelf Life | 24 months | – |
| Property | Value | Test Method |
|---|---|---|
| Drying Time to Handle | 30 min | Fed-Std-141, Method 4061 |
| Recommended Coating Thickness | 25 – 75 µm | – |
| Curing Conditions | 24 hrs @ RT or 2 hrs @ 76°C | – |
| Time to Reach Optimum Properties | 7 days | – |
| Thermal Shock Resistance | -65°C to 125°C (50 cycles) | MIL-I-46058C |
| Glass Transition Temperature (Tg) | 42°C | DSC |
| Coefficient of Thermal Expansion | 67 ppm/°C | TMA |
| Modulus | 11.1 MPa | DMA |
| Flammability Rating | V-0 | UL 94 |
| Dielectric Withstand Voltage | >1500V | MIL-I-46058C |
| Dielectric Breakdown Voltage | 6300V | ASTM D149 |
| Dielectric Constant (1MHz, 25°C) | 2.6 | ASTM D150-98 |
| Dissipation Factor (1MHz, 25°C) | 0.010 | ASTM D150-98 |
| Insulation Resistance | 5.5 × 10¹⁴ Ω | MIL-I-46058C |
| Moisture Insulation Resistance | 7.0 × 10¹⁰ Ω | MIL-I-46058C |
| Fungus Resistance | Passes | ASTM G21 |
Thinner: HumiSeal® Thinner 73
Remover: HumiSeal® Stripper 1080, 1080A
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.