HumiSeal® 2A64 is a two-component polyurethane conformal coating designed for general printed circuit board (PCB) applications. It is characterized by high solids content, low viscosity for easy application, and UV fluorescence for inspection. The coating meets MIL-I-46058C, IPC-CC-830, and RoHS Directive 2011/65/EC compliance standards.
| Property | Value |
|---|---|
| Mixing Ratio (A:B) | 1:1 by volume |
| Pot Life at Room Temperature | 8 hours |
| Shelf Life at Room Temperature | 12 months |
| Recommended Thinner | HumiSeal® Thinner 64 |
| Recommended Stripper | HumiSeal® Stripper 1072 |
| Property | Value |
|---|---|
| Density | 1.07 ± 0.03 g/cm³ |
| Solids Content | 55 ± 5% |
| Viscosity | 130 ± 50 cP |
| VOC | 501 g/L |
| Recommended Coating Thickness | 25 – 75 µm |
| Drying Time to Handle | 15 minutes |
| Curing Condition | 3 hrs @ 76°C |
| Property | Value |
|---|---|
| Thermal Shock Resistance | -65°C to 125°C |
| Coefficient of Thermal Expansion | 82 ppm/°C (Below Tg), 255 ppm/°C (Above Tg) |
| Glass Transition Temperature (Tg) | 12°C |
| Modulus (DMA) | 4101 MPa @ -40ºC, 2777 MPa @ 25ºC, 2 MPa @ 80ºC |
| Flammability | Self-Extinguishing |
| Dielectric Withstand Voltage | >1500V |
| Dielectric Breakdown Voltage | 3500V |
| Dielectric Constant (1MHz, 25°C) | 3.5 |
| Dissipation Factor (1MHz, 25°C) | 0.024 |
| Insulation Resistance | 4.5 x 10¹⁴ Ω |
| Moisture Insulation Resistance | 4.8 x 10¹⁰ Ω |
| Fungus Resistance | Passes |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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