1. Product Overview

Indium PASTEOT-82711 is a no-clean, lead-free solder paste designed for high-performance PCB assembly. It features low voiding, high oxidation resistance, and superior wetting properties, making it ideal for miniaturized components, QFNs, BGAs, and CSPs. Its oxidation-inhibiting formulation helps eliminate head-in-pillow (HIP) and graping defects, ensuring reliable solder joints even under extended reflow profiles.

2. Applications

• PCB assembly for high-reliability electronics
• Fine-pitch soldering for BGA, CSP, QFN, and RF shielding
• High-density PCB designs requiring excellent print definition
• Reflow under both air and nitrogen atmospheres
• Applications with difficult-to-solder or oxidized metallizations