Indium PASTEOT-800550-500g-T4 is a lead-free, no-clean solder paste designed for high-reliability SMT applications. It contains SAC305 alloy (96.5% Tin, 3% Silver, 0.5% Copper) with Type 4 powder and 89.5% metal content in a 500g cartridge. The paste is optimized for fine-pitch components, offering high transfer efficiency, excellent oxidation resistance, and minimal voiding, ensuring superior electrical reliability and stencil life.
| Property | Specification |
|---|---|
| Brand | Indium |
| Alloy | SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) |
| Flux Type | No-Clean |
| Lead Content | Lead-Free |
| Powder Mesh Size | T4 |
| Metal Percentage | 89.5% |
| Halogen Content | Halogen-Free |
| Package Type | 500g Cartridge |
| Shelf Life | 1 Year |
| Physical State | Paste |
| Series | 8.9HF Series |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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