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Indium 8.9HF – Indium PASTEOT-800970 Solder Paste, No Clean, T5, 88%, SAC305, 500g Jar

• Alternate Product Number: Contact Techniq VN for details.
• Mfr Part: PASTEOT-800970
• Brand: Indium
• Alloy: SAC305
• Lead Type: Lead Free
• Composition: 96.5% Tin, 3% Silver, 0.5% Copper
• Powder Mesh Size: T5
• Type: Solder Paste
• Flux Characteristics: No-Clean
• Package: 500g Jar
• Shelf Life: 365 days

1. Product Overview

Indium PASTEOT-800970 is a no-clean, lead-free solder paste designed for SMT applications requiring high reliability and excellent voiding performance. Formulated with SAC305 alloy and Type 5 powder, it ensures high transfer efficiency, superior oxidation resistance, and long stencil life. The halogen-free composition makes it suitable for environmentally friendly electronics manufacturing.


2. Applications

  • PCB assembly for high-reliability electronics
  • BGA, CSP, QFN, and fine-pitch components (≤0.66AR apertures)
  • Printing, dispensing, jetting, and pin transfer assembly
  • Minimizes warpage-induced defects, voiding, and insufficient solder volume
  • Compatible with both Pb-free and SnPb processes

3. Typical Properties

Property Specification
Brand Indium
Alloy SAC305 (96.5% Sn, 3% Ag, 0.5% Cu)
Flux Type ROL0 (No-Clean)
Lead Content Lead-Free
Powder Mesh Size T5
Metal Percentage 88%
Halogen Content Halogen-Free
Package Type 500g Jar
Shelf Life 365 days
Physical State Paste
Series 8.9HF Series

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