Indium PASTEOT-801399-10g-T6 is a no-clean, lead-free solder paste formulated for high-precision SMT applications. It features SAC305 alloy with Type 6 fine powder, making it ideal for fine-pitch and microelectronics assembly. The halogen-free formulation ensures high electrical reliability, low voiding, and excellent wetting properties.
| Property | Specification |
|---|---|
| Brand | Indium |
| Alloy | SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) |
| Flux Type | No-Clean (ROL0) |
| Lead Content | Lead-Free |
| Powder Mesh Size | T6 |
| Metal Percentage | 82.5% |
| Halogen Content | Halogen-Free |
| Package Type | 10cc Syringe |
| Shelf Life | 1 Year |
| Physical State | Paste |
| Series | 8.9HF Series |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
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Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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