1. Product Overview

Indium PASTEOT-800596-600g-T4 is a no-clean, lead-free solder paste designed for high-performance PCB assembly and semiconductor manufacturing. It features excellent oxidation resistance to eliminate graping and Head-in-Pillow (HIP) defects, making it highly reliable for various electronic applications. The paste is formulated with Indium8.9HF1 flux, which provides superior stencil print transfer efficiency and minimizes false failures in in-circuit testing (ICT).

2. Applications

• PCB assembly and semiconductor manufacturing
• Suitable for fine-pitch components, including 0.4mm pitch CSPs
• Ideal for various soldering process techniques, such as printing, dipping, dispensing, jetting, and pin transfer
• Reduces end-of-line defects caused by warpage, voiding, and insufficient solder paste volume