Indium PASTEOT-82698-500g-T3 is a no-clean, leaded solder paste formulated with NC-SMQ®92H flux. It features a Sn63Pb37 alloy, T3 powder, and 90% metal content. This halogen-free paste is designed for fine-pitch printing, extended stencil life, low flux spatter, and excellent wetting in air reflow processes. The clear, benign residue is compatible with common conformal coatings.
| Property | Specification |
|---|---|
| Brand | Indium |
| Alloy | Sn63Pb37 (63% Tin, 37% Lead) |
| Lead-Free | No |
| Flux Type | No-Clean (NC-SMQ®92H) |
| Powder Mesh Size | T3 |
| Metal Content | 90% |
| Physical State | Paste |
| Package Type | 500g Jar |
| Reflow Atmosphere | Air |
| Residue Type | Clear, benign, compatible with conformal coatings |
| Stencil Life | Extended |
| Tack Time | Long |
| Flux Spatter | Low |
| Shelf Life | 180 days |
| Series | NC-SMQ®92H |
| Halogen-Free | Yes |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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