Indium PASTEOT-801216-600G-T3 is a water-soluble, lead-free solder paste formulated with SAC305 alloy for air or nitrogen reflow. Designed with Indium6.4R flux, it offers exceptional printing performance, minimal voiding, and excellent wetting on various surface finishes. It supports both SnPb and Pb-free assembly processes, making it highly versatile.
| Property | Specification |
|---|---|
| Brand | Indium |
| Alloy | SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) |
| Lead-Free | Yes |
| Flux Type | Water-Soluble (Indium6.4R) |
| Powder Mesh Size | T3 |
| Metal Content | 88.75% |
| Physical State | Paste |
| Package Type | 600g Cartridge |
| Reflow Atmosphere | Air or Nitrogen |
| Voiding Performance | Lowest levels of voiding |
| Shelf Life | 180 days |
| Series | Indium6.4R Series |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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