Indium PASTEOT-801644 is a water-soluble, leaded solder paste formulated with Sn63Pb37 alloy for air or nitrogen reflow. It features Indium6.6HF flux, offering exceptional wetting, low voiding, and outstanding cleanability. The paste is optimized for BGA, CSP, and bottom termination components (BTCs) such as QFNs and DPAKs, ensuring minimal voiding and superior soldering performance.
| Property | Specification |
|---|---|
| Brand | Indium |
| Alloy | Sn63Pb37 (63% Tin, 37% Lead) |
| Lead-Free | No |
| Flux Type | Water-Soluble (Indium6.6HF) |
| Powder Mesh Size | T3 |
| Metal Content | 90% |
| Physical State | Paste |
| Package Type | 500g Jar |
| Reflow Atmosphere | Air or Nitrogen |
| Voiding Performance | Low voiding for BGAs, CSPs, and BTCs |
| Stencil Life | Long |
| Shelf Life | 180 days |
| Series | Indium6.6HF Series |
| Water Soluble | Yes |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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