Indium PASTEOT-801644 is a water-soluble, leaded solder paste featuring Sn63Pb37 alloy and Indium6.6HF flux. It is optimized for air or nitrogen reflow and offers low voiding, superior wetting, and outstanding cleanability. This solder paste is specifically designed for fine-pitch components (BGA, CSP, QFN, DPAK, LGA, BTCs), ensuring minimal voiding and exceptional stencil performance.
| Property | Specification |
|---|---|
| Brand | Indium |
| Alloy | Sn63Pb37 (63% Tin, 37% Lead) |
| Lead-Free | No |
| Flux Type | Water-Soluble (Indium6.6HF) |
| Powder Mesh Size | T3 |
| Metal Content | 90% |
| Physical State | Paste |
| Package Type | 700g Cartridge |
| Reflow Atmosphere | Air or Nitrogen |
| Voiding Performance | Low voiding for BGAs, CSPs, and BTCs |
| Stencil Life | Long |
| Shelf Life | 180 days |
| Series | Indium6.6HF Series |
| Water Soluble | Yes |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
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Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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