Applications

INSULGEL 70 CC – Semi-flexible epoxy compound for encapsulation, potting, and components needing thermal shock resistance

Item Name: INSULGEL 70 CC
Manufacturer: ITW Performance Polymers
Technologies: Semi-flexible epoxy compound with low coefficient of thermal expansion
Color: Black (base), Amber (curing agents)
Cure Type: Room temperature or heat cure (depending on curing agent)
Package Size: Contact to Techniq VN for details.
Shelf Life: 12 months

1. Product Overview

INSULGEL 70 CC is a semi-flexible epoxy compound formulated with low shrinkage and a low coefficient of thermal expansion. Thanks to its flexible epoxy resin base and advanced filler technology, it provides superior thermal shock resistance, reduced internal stress, and improved adhesion to components. Multiple curing agents (B-1, Insulcure 9, Insulcure 11B) are available to meet specific processing needs—ranging from fast curing for small parts to extended pot life for large batches or high-temperature performance.

Key Features & Benefits:

  • Excellent thermal shock resistance.

  • Low shrinkage and low CTE for stress reduction.

  • Multiple curing options (room temperature, fast cure, heat cure).

  • Strong adhesion and mechanical resilience.

  • Service temperature range up to –55°C to +155°C depending on hardener.

  • Shelf life: 12 months (all components).


2. Applications

  • Encapsulation and potting of sensitive electronic or electrical components.

  • Adhesive or casting compound where low CTE and thermal cycling resistance are required.

  • High-reliability environments (electronics, aerospace, industrial power systems).

3. Typical Properties

Uncured Properties

Property Method Unit Base Resin (70 CC) Part B-1 Insulcure 9 Insulcure 11B
Colour Visual Black Amber Amber Amber
Viscosity @25°C ASTM D2393 cps 16,000 <20 55 200
Specific Gravity 1.53 0.98 1.00 0.95
Mix Ratio (by wt.) 100 9–10 3.5–4.5 8
Pot Life (100 g @25°C) hrs 8–10 0.5–0.75 2–2.5
Shelf Life months 12 12 12 12

Cured Properties

Property Method Unit Part B-1 Insulcure 9 Insulcure 11B
Hardness ASTM D2240 Shore D 43 75 80
Tensile Strength ASTM D638 psi / MPa 1,000 / 7 1,900 / 13 2,500 / 17
Tensile Elongation ASTM D638 % 120 30 20
Coefficient of Thermal Expansion °C⁻¹ 64×10⁻⁶ 66×10⁻⁶ 70×10⁻⁶
Thermal Conductivity BTU-in/(ft²·hr·°F) 3.6 4.3 4.2
Service Temperature °C –40 to +105 –40 to +105 –55 to +155
Dielectric Strength ASTM D149 V/mil 400 400 425
Dielectric Constant (1 KHz) ASTM D150 3.9 4.5 4.5
Dissipation Factor (1 KHz) ASTM D150 0.08 0.30 0.38
Volume Resistivity @25°C ASTM D257 Ω·cm 7×10¹² 1×10¹⁴ 1×10¹⁵
Volume Resistivity @100°C ASTM D257 Ω·cm 1×10¹⁰ 1×10¹¹ 1×10¹³

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