1. Product Overview:
LOCTITE® SI 5699™ is a one-component, non-corrosive oxime silicone sealant designed primarily for flange sealing. It provides excellent oil resistance and is suitable for sealing rigid flanges, such as transmissions and cast metal housings. The product is thixotropic, preventing migration after application, and cures at room temperature (RTV). It is NSF P1 registered for use in food processing areas (where no food contact occurs).
2. Applications:
3. Typical Properties – Uncured & Cured (Table Format):
| Property | Value / Range | Test Standard |
|---|---|---|
| Uncured Properties | ||
| Specific Gravity @ 20°C | 1.45 | – |
| Extrusion Rate (g/min) | ≥200 | – |
| Tack Free Time (min) | ≤30 | – |
| Cured Properties (1 week @ 25°C / 50±5% RH) | ||
| Shore Hardness (A) | 45 to 75 | ISO 868 |
| Elongation (%) | ≥100 | ISO 37 |
| Tensile Strength (N/mm²) | ≥2.4 (≥348 psi) | ISO 37 |
| Adhesive Properties (14 days @ 23°C, 60±5% RH, 0.5 mm gap) | ||
| Lap Shear Strength – Aluminum (N/mm²) | 0.1 to 0.7 | – |
| Lap Shear Strength – Zinc Dichromate (N/mm²) | 0.7 to 1.5 | – |
| Lap Shear Strength – Mild Steel (N/mm²) | 1.3 to 2.1 | – |
| Lap Shear Strength – Abraded Aluminum (N/mm²) | 1.3 to 2.0 | – |
| Electrical Properties | ||
| Surface Resistivity (Ω) | 2×10¹⁵ | IEC 60093 |
| Volume Resistivity (Ω·cm) | 2×10¹⁵ | IEC 60093 |
| Dielectric Constant (100Hz / 10kHz / 10MHz) | 2.8 / 4.0 / 4.1 | IEC 60250 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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