Item Number: NP505-HR
Manufacturer: Kester®
Lead Type: Lead-Free (RoHS compliant)
Alloys: SAC305 (Sn96.5/Ag3.0/Cu0.5)
Type: No-clean solder paste
Package: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.
Kester NP505-HR is a high-reliability, no-clean solder paste formulated for lead-free assembly processes. Engineered to provide excellent solder joint formation and superior wetting, it ensures consistent performance in high-density and fine-pitch applications. The paste exhibits stable rheology, long stencil life, and minimal residue, making it suitable for advanced electronics manufacturing where quality and process control are paramount.
NP505-HR is designed for surface mount technology (SMT) applications, including QFP, BGA, and other fine-pitch components. It is compatible with both wave and reflow soldering processes and is particularly effective in high-volume production, precision soldering, and rework operations requiring predictable, reliable performance.
Alloy: SAC305 (Sn96.5/Ag3.0/Cu0.5)
Flux Type: No-clean, halogen-free
Viscosity: Optimized for stencil printing and dispensing
Residues: Minimal, non-corrosive, safe for no-clean process
Print Life: Extended stencil life, stable under production conditions
Reflow Profile: Suitable for both standard and lead-free reflow temperature profiles
Storage: Refrigerated storage recommended to maintain paste consistency and performance
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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