Item Number: TSF-6852
Manufacturer: Kester®
Flux Type/ Chemistry: No-clean tacky flux
Viscosity/ Form: High-viscosity tacky flux (paste form)
Activity/ Classification: IPC J-STD-004 classification ROL0
Packaging: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.
Kester TSF-6852 is an advanced tacky soldering flux, specifically designed to deliver superior performance in semiconductor packaging and surface mount assembly. It is formulated to provide excellent wettability, reliable joint integrity, and optimized residue characteristics, ensuring consistent high-yield production. The material is engineered to be halogen-free, enhancing both environmental compliance and device reliability.
TSF-6852 is primarily recommended for use in ball attach processes, flip-chip applications, and rework operations. Its rheological profile makes it ideal for stencil printing, pin transfer, and syringe dispensing, thereby enabling versatility across a wide range of assembly methods. The flux is particularly suited for high-density interconnects and fine-pitch components where precision and repeatability are critical.
Flux Type: Tacky flux, halogen-free
Viscosity: Optimized for stencil printing and dispensing applications
Residues: Minimal, non-corrosive, and safe for no-clean processes
Compatibility: Suitable with a wide range of leaded and lead-free solder alloys
Reflow Performance: Exhibits robust activity across standard and lead-free profiles
Storage: Stable under controlled refrigeration to maintain viscosity and fluxing activity
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