Item Name: KYZEN® E5325
Manufacturer: KYZEN Corporation
Soil/Flux Compatibility: Compatible with aluminum, copper, steel, epoxy, polyester composites, and baked-on fluxes/solder pastes
Chemistry/Key flags: Aqueous, alkaline (pH 11), RoHS compliant, halogen-free, VOC 10%, non-flammable, water soluble
Process/Equipment: Spray-in-air cleaning, compatible with batch washers, in-line washers, ultrasonic systems, SUI systems, vapor degreasers
Package Size: 1 Gallon; 5 Gallons; 55 Gallons; 5 Liters; 25 Liters; 200 Liters
Shelf Life: 5 years
1. Product Overview
KYZEN® E5325 is an aqueous, low-odor spray-in-air cleaner specifically formulated for maintenance and pallet cleaning in electronic assembly processes. It effectively removes baked-on fluxes and solder pastes while minimizing wash time, machine downtime, and overall production costs. The solution is fully water-soluble, RoHS compliant, halogen-free, and environmentally safe, with negligible global warming potential. E5325 is compatible with aluminum, copper, steel, epoxy, and polyester composites and works at ambient to elevated temperatures, providing a cost-efficient cleaning solution for repeated use. The product has a shelf life of five years when stored in polyethylene containers at 5–50°C.
2. Applications
KYZEN® E5325 is suitable for:
Spray-in-air maintenance cleaning
Pallet cleaning in wave solder and reflow oven systems
Off-line tooling cleaning
Batch and in-line washers, vapor degreasers
Free trials and process optimization are available to maximize cleaning efficiency and yield.
3. Typical Properties – Specifications
pH (10g/L): 11
Flash Point: None to boiling
Boiling Point: 103°C / 217°F
Water Solubility: Complete
Recommended Concentration:
Pallets: 3–10%
Maintenance: 5–10%
Operating Temperature Range: Ambient to 60°C / 140°F
Rinse: Deionized water recommended
Drying Method: Hot air
Additional Features
Compatible with all common materials in electronic assembly
Supports complimentary cleaning trials and process optimization
ISO 9001:2015 certified for quality and process control
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