Applications

KYZEN® E5611 – Stencil and misprinted board cleaner for flux, solder paste and uncured adhesive removal

  • Item Name: KYZEN® E5611

  • Manufacturer: Kyzen Corporation

  • Soil/Flux Compatibility: Removes flux, raw solder paste, and uncured adhesives from stencils and misprinted boards; compatible with most stencil cleaning equipment

  • Chemistry/Key flags: Biodegradable aqueous solution, non-hazardous, partially miscible in water, no CFCs or HAPs, low VOC (82.2 g/L), non-flammable

  • Process/Equipment: Spray-in-air and ultrasonic cleaning; batch washers, in-line washers, ultrasonic systems

  • Package Size: 1 gal, 5 L, 5 gal, 25 L, 55 gal, 200 L

  • Shelf Life: 5 years (≥5 gal / 25 L sealed containers)

1. Product Overview
KYZEN® E5611 is a next-generation, cost-effective stencil and misprinted board cleaner, formulated to remove flux, solder paste, and uncured adhesives efficiently. It is a biodegradable, non-hazardous aqueous solution, free from CFCs and HAPs, making it environmentally friendly and safe for operators. E5611 functions effectively at ambient temperature and is compatible with standard stencil cleaning equipment. Designed for dilution, it performs optimally at low concentrations and supports both spray-in-air and ultrasonic cleaning processes. The product has a shelf life of five years when stored under recommended conditions (5–30°C in original polyethylene containers).

2. Applications
KYZEN® E5611 is suitable for:

  • Spray-in-air and ultrasonic stencil cleaning systems

  • Batch and in-line washers

  • Vapor degreasers

  • Cleaning misprinted boards

Complementary trials and process optimization services are available globally to ensure the highest cleaning efficiency and yield.

3. Typical Properties – Specifications

  • pH (10g/L): Not applicable

  • Flash Point: None to boiling

  • Boiling Point: 103°C / 219°F

  • Water Solubility: Partially miscible

  • VOC (10% solution): 82.2 g/L

  • Recommended Concentration: <25%

  • Operating Temperature Range: Up to 49°C / 120°F

  • Rinse: Deionized water recommended

  • Drying Method: Hot air

Additional Features

  • Compatible with all common materials in electronic assembly

  • Free factory or laboratory trials to optimize cleaning processes

  • Supports enhanced product reliability and yield through process parameter tuning

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