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KYZEN® E5631 – Stencil and misprinted board cleaner for raw solder paste and uncured adhesive removal

  • Item Name: KYZEN® E5631

  • Manufacturer: Kyzen Corporation

  • Soil/Flux Compatibility: Removes raw solder paste, flux residues, and uncured adhesives from stencils and misprinted boards; compatible with stencil materials and cleaning equipment

  • Chemistry/Key flags: Biodegradable aqueous solution, non-hazardous, partial water solubility, no CFCs or HAPs, low VOC (87.4 g/L), non-flammable

  • Process/Equipment: Spray-in-air and ultrasonic stencil cleaning; batch washers, in-line washers, ultrasonic systems

  • Package Size: 1 gal, 5 L, 5 gal, 25 L, 55 gal, 200 L

  • Shelf Life: 5 years (≥5 gal / 25 L sealed containers)

1. Product Overview
KYZEN® E5631 is an advanced, next-generation stencil and misprinted board cleaner, specifically formulated to remove flux and uncured adhesives efficiently. It is a biodegradable, non-hazardous aqueous solution that is free from CFCs and HAPs, ensuring both user safety and environmental compliance. The product demonstrates excellent compatibility with stencils and common materials used in electronic assembly manufacturing. It is cost-effective, can be used at low concentrations, and is suitable for a variety of cleaning processes including spray-in-air and ultrasonic applications. E5631 is designed for long-term stability, with a shelf life of up to five years when stored under recommended conditions (5–50°C in original polyethylene containers).

2. Applications
KYZEN® E5631 is versatile and can be deployed in multiple stencil cleaning processes, including:

  • Spray-in-air systems

  • Ultrasonic cleaning systems

  • Batch and in-line washers

  • Vapor degreasers

It is also suitable for cleaning misprinted boards and can be adapted to specific factory processes through complimentary on-site or laboratory trials provided by KYZEN. The solution ensures improved product reliability and yield by optimizing critical cleaning parameters.

3. Typical Properties – Specifications

  • pH (10g/L): Not applicable

  • Flash Point: None to boiling

  • Boiling Point: 104°C / 220°F

  • Water Solubility: Partial

  • VOC (10% solution): 87.4 g/L

  • Recommended Concentration: <25%

  • Operating Temperature Range: Ambient to 49°C / 120°F

  • Rinse: Deionized water recommended

  • Drying Method: Hot air

Additional Features

  • Favorable GHS and safety ratings

  • Compatible with all common materials in electronic assembly

  • KYZEN offers free cleaning trials and process optimizations to ensure maximal efficiency and reliability

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