Applications

LOCTITE® 3611 – Epoxy surface mount adhesive for bonding SMDs to PCBs prior to wave soldering

  • Item Name: LOCTITE 3611
  • Manufacturer: Henkel
  • Product Category: Surface Mount Adhesive
  • Technologies: One-component epoxy system (no mixing required)
  • Applications: Bonding SMD components to PCBs and small parts, ideal for high-speed SMT lines prior to wave soldering
  • Color: Red viscous gel (fluoresces under UV light)
  • Cure Type: Heat cure
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: Contact Techniq VN for details.

1. Product Overview

LOCTITE 3611 is a one-component, red epoxy adhesive designed for bonding surface-mounted devices (SMDs) to printed circuit boards before wave soldering. It provides very high wet strength and fast curing on high-speed SMT lines. Its low moisture absorption allows extended exposure to humidity without affecting dispensability or causing void formation.

2. Applications

  • Bonding SMD components to PCBs
  • Small parts bonding
  • Suitable for pin transfer and stencil printing methods

3. Typical Properties

Property Value
Uncured Properties
Appearance Red viscous gel
Specific Gravity @ 25°C 1.3
Yield Point (Pa) 125 – 400
Casson Viscosity (Pa∙s) 20 – 50
Fluorescence Positive under UV light
Curing Performance
Recommended Cure 90-120s @ 150°C
Isothermal DSC Conversion (5 min @ 125°C) 95-100%
Cured Properties
Coefficient of Thermal Expansion (K⁻¹) 70 × 10⁻⁶
Thermal Conductivity (W/m·K) 0.4
Specific Heat (kJ/kg·K) 0.3
Density @ 25°C (g/cm³) 1.4
Glass Transition Temperature (°C) 73
Electrical Properties
Dielectric Constant (1 kHz) 3.3
Volume Resistivity (Ω·cm) 2 × 10¹⁵
Surface Resistivity (Ω) 50 × 10¹⁵
Mechanical Performance (Cured)
Pull-off Strength (N) 22 – 46
Torque Strength (N·mm) 33 – 63
Push-off Strength (N) ≥30
Lap Shear Strength (Steel, N/mm²) ≥15

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