LOCTITE 3611 is a one-component, red epoxy adhesive designed for bonding surface-mounted devices (SMDs) to printed circuit boards before wave soldering. It provides very high wet strength and fast curing on high-speed SMT lines. Its low moisture absorption allows extended exposure to humidity without affecting dispensability or causing void formation.
| Property | Value |
|---|---|
| Uncured Properties | |
| Appearance | Red viscous gel |
| Specific Gravity @ 25°C | 1.3 |
| Yield Point (Pa) | 125 – 400 |
| Casson Viscosity (Pa∙s) | 20 – 50 |
| Fluorescence | Positive under UV light |
| Curing Performance | |
| Recommended Cure | 90-120s @ 150°C |
| Isothermal DSC Conversion (5 min @ 125°C) | 95-100% |
| Cured Properties | |
| Coefficient of Thermal Expansion (K⁻¹) | 70 × 10⁻⁶ |
| Thermal Conductivity (W/m·K) | 0.4 |
| Specific Heat (kJ/kg·K) | 0.3 |
| Density @ 25°C (g/cm³) | 1.4 |
| Glass Transition Temperature (°C) | 73 |
| Electrical Properties | |
| Dielectric Constant (1 kHz) | 3.3 |
| Volume Resistivity (Ω·cm) | 2 × 10¹⁵ |
| Surface Resistivity (Ω) | 50 × 10¹⁵ |
| Mechanical Performance (Cured) | |
| Pull-off Strength (N) | 22 – 46 |
| Torque Strength (N·mm) | 33 – 63 |
| Push-off Strength (N) | ≥30 |
| Lap Shear Strength (Steel, N/mm²) | ≥15 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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