| Property | Value |
|---|---|
| Specific Gravity (25°C) | 1.33 |
| Yield Point (Pa) | 250 – 650 |
| Casson Viscosity (Pa·s) | 15 – 55 |
| Flash Point | See SDS |
| Property | Value |
|---|---|
| Coefficient of Thermal Expansion (K⁻¹) | 86 × 10⁻⁶ |
| Thermal Conductivity (W/m·K) | 0.2 |
| Specific Heat (kJ/kg·K) | 0.3 |
| Density (g/cm³) | 1.3 |
| Glass Transition Temperature (°C) | 140 |
| Property | Value |
|---|---|
| Dielectric Constant (1 kHz) | 2.8 |
| Dielectric Breakdown Strength (kV/mm) | 33.5 |
| Volume Resistivity (Ω·cm) | 4.6 × 10¹⁵ |
| Surface Resistivity (Ω) | 28 × 10¹⁵ |
| Test | Value |
|---|---|
| Lap Shear Strength (Steel, 150°C, 30 min) | ≥ 15 N/mm² (≥ 2175 psi) |
| Pull-off Strength (C-1206, 125°C, 5 min) | 46 N (10.3 lb) |
| Torque Strength (C-1206, 150°C, 3 min) | 54 N·mm (7.6 in.oz) |
| Push-off Strength (C-1206, 150°C, 3 min) | ≥ 30 N (≥ 6.7 lb) |
| Condition | % Strength Retention |
|---|---|
| Air (22°C) | 100% |
| 98% RH (40°C) | 80-90% |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
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