LOCTITE 3621 is a one-component, heat-curing epoxy adhesive designed for bonding surface-mounted devices (SMDs) to printed circuit boards (PCBs) before wave soldering. It offers high wet strength, excellent electrical characteristics, and is particularly suited for high-speed dispensing applications (>35,000 dots/h). The adhesive is compatible with lead-free soldering processes using water- and alcohol-based fluxes.
| Property | Value |
|---|---|
| Specific Gravity (25°C) | 1.22 |
| Yield Point (Pa) | 130 – 280 |
| Casson Viscosity (Pa∙s) | 0.5 – 3 |
| Particle Size (µm) | <150 |
| Appearance | Red viscous gel |
| Condition | Cure Time |
|---|---|
| 150°C | 90 – 120 sec |
| 125°C | 5 min (≥90% cure conversion) |
| 150°C | 30 min (full cure) |
| Property | Value |
|---|---|
| Glass Transition Temp (°C) | 110 |
| Thermal Conductivity (W/m·K) | 0.3 |
| Density (g/cm³) | 1.16 |
| Coefficient of Thermal Expansion (K⁻¹) | 100×10⁻⁶ (25–70°C) / 218×10⁻⁶ (90–150°C) |
| Property | Value |
|---|---|
| Volume Resistivity (Ω·cm) | 1.3×10¹⁵ |
| Surface Resistivity (Ω) | 52×10¹⁵ |
| Dielectric Breakdown Strength (kV/mm) | 40 |
| Dielectric Constant (1kHz) | 2.94 |
| Test Condition | Strength |
|---|---|
| Pull-off Strength (C-1206 on FR4) | 50 N (13 lb) |
| Torque Strength (C-1206 on FR4) | 60 N·mm (9.6 in.oz) |
| Push-off Strength (3 min @150°C) | ≥27 N (≥6.0 lb) |
| Lap Shear Strength (Mild Steel) | ≥15 N/mm² (≥2,175 psi) |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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