LOCTITE 3621 is a one-component, heat-curing epoxy adhesive designed for bonding surface-mounted devices (SMDs) to printed circuit boards (PCBs) before wave soldering. It offers high wet strength, excellent electrical characteristics, and is particularly suited for high-speed dispensing applications (>35,000 dots/h). The adhesive is compatible with lead-free soldering processes using water- and alcohol-based fluxes.
| Property | Value |
|---|---|
| Specific Gravity (25°C) | 1.22 |
| Yield Point (Pa) | 130 – 280 |
| Casson Viscosity (Pa∙s) | 0.5 – 3 |
| Particle Size (µm) | <150 |
| Appearance | Red viscous gel |
| Condition | Cure Time |
|---|---|
| 150°C | 90 – 120 sec |
| 125°C | 5 min (≥90% cure conversion) |
| 150°C | 30 min (full cure) |
| Property | Value |
|---|---|
| Glass Transition Temp (°C) | 110 |
| Thermal Conductivity (W/m·K) | 0.3 |
| Density (g/cm³) | 1.16 |
| Coefficient of Thermal Expansion (K⁻¹) | 100×10⁻⁶ (25–70°C) / 218×10⁻⁶ (90–150°C) |
| Property | Value |
|---|---|
| Volume Resistivity (Ω·cm) | 1.3×10¹⁵ |
| Surface Resistivity (Ω) | 52×10¹⁵ |
| Dielectric Breakdown Strength (kV/mm) | 40 |
| Dielectric Constant (1kHz) | 2.94 |
| Test Condition | Strength |
|---|---|
| Pull-off Strength (C-1206 on FR4) | 50 N (13 lb) |
| Torque Strength (C-1206 on FR4) | 60 N·mm (9.6 in.oz) |
| Push-off Strength (3 min @150°C) | ≥27 N (≥6.0 lb) |
| Lap Shear Strength (Mild Steel) | ≥15 N/mm² (≥2,175 psi) |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.