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LOCTITE 3627 – Non-conductive epoxy adhesive for surface-mount device bonding in electronics manufacturing applications.

  • Item Name: LOCTITE 3627
  • Manufacturer: Henkel
  • Product Category: Surface Mount Adhesive
  • Technologies: One-component epoxy (no mixing required)
  • Applications: Bonding SMD components to PCBs and small parts; suitable for high dispense speeds and stencil print applications, including lead-free processes
  • Color: Red gel-like (uncured)
  • Cure Type: Heat cure
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: Contact Techniq VN for details.

1. Product Overview

  • Technology: Epoxy
  • Type: One-component, heat-curing adhesive
  • Appearance: Red gel-like material
  • Key Features: High dispense speeds, high dot profile, strong wet strength, good electrical characteristics
  • Application Method: Syringe dispensing and stencil printing

2. Applications

  • Bonding surface-mounted devices (SMDs) to PCBs before wave soldering
  • Small parts bonding
  • Compatible with lead-free soldering processes (water and alcohol-based fluxes)

3. Typical Properties

Uncured Properties
Property Value
Specific Gravity (@ 25°C) 1.3
Particle Size (µm) <100
Yield Point (Pa) 100 to 275
Casson Viscosity (@ 25°C, Pa·s) 2 to 5
Curing Performance
  • Recommended curing: 90–120 sec @ 150°C
  • Curing conversion: ≥75% after 5 min @ 125°C
Cured Properties
Property Value
Thermal Expansion (K⁻¹) 75 × 10⁻⁶ (26–56°C), 111 × 10⁻⁶ (90–150°C)
Thermal Conductivity (W/m·K) 0.3
Glass Transition Temperature (°C) 105
Volume Resistivity (Ω·cm) 62 × 10¹⁵
Surface Resistivity (Ω) 19 × 10¹⁵
Adhesion & Strength
Test Value
Pull-off Strength (C-1206 on FR4, N) 58 (13 lb)
Push-off Strength (C-1206 on FR4, N) ≥27.5 (≥6.1 lb)
Torque Strength (N·mm) 55 (10.5 in·oz)
Lap Shear Strength (Steel, N/mm²) ≥13.5 (≥1,957 psi)
Environmental Resistance
  • Hot Solder Dip (260°C for 10 sec): Pass
  • Lead-free solder resistance: No component loss
  • Storage Conditions: 2°C to 8°C

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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