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LOCTITE® 4311™ – Adhesive – Bonding

Item Name: LOCTITE® 4311™
Manufacturer: Henkel
Technologies: Cyanoacrylate/UV (Ethyl cyanoacrylate with photoinitiator)
Color: Transparent, light yellow-green to dark blue-green liquid
Cure Type: Ultraviolet (UV) / Visible light; Secondary Cure: Humidity
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.

1. Product Overview

LOCTITE® 4311™ is a one-part cyanoacrylate adhesive with UV/visible light curing and secondary humidity curing. It is designed for rapid fixturing, fillet cure, and surface cure, minimizing blooming and eliminating the need for solvent-borne accelerators. It is suitable for bonding plastics, rubbers, and metals and is compliant with ISO 10993 biocompatibility standards for medical device assembly.

2. Applications

  • Bonding of plastics, rubbers, and metals
  • Medical device assembly
  • Applications requiring fast curing with UV/visible light

3. Typical Properties

Uncured Properties

Property Value
Appearance Transparent, light yellow-green to dark blue-green liquid
Specific Gravity @ 25°C 1.06
Viscosity (mPa·s) 600 – 1,500
Fluorescence Positive under UV light

Curing Performance

Cure Method Depth of Cure (mm) Cure Time (s)
UV (365 nm, 100 mW/cm²) 6 60
LED (405 nm, 100 mW/cm²) 7 60
Tack-Free Time (365 nm, 30 mW/cm²) ≤10

Cured Properties

Property Value
Glass Transition Temperature (°C) 102
Shore Hardness (D) 84
Tensile Strength (MPa) 50
Elongation at Break (%) 5.2
Tensile Modulus (MPa) 1,860

Adhesive Performance (Block Shear Strength, ISO 13445)

Substrate Strength (N/mm²) Strength (psi)
Acrylic to Acrylic 14.2 2,050
Polycarbonate to Polycarbonate 22.4 3,260
Polycarbonate to Steel (grit blasted) 13 1,880

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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